infineon IGBT新型装配技术应用于高电压
infineonIGBT新型装配技术应用于高电压NewsuperiorassemblytechnologiesformoduleswithhighestpowerdensitiesDr.RolandOtt,MarcoBler,RomanTschirbs,DirkSiepe,InfineonTechnologiesAG,GermanyAbstractPowermoduledevelopmentisstrivingforhigherpowerdensities,notonlyinnewbutalsoinalreadyestablishedpackages.Twomainchallengesforsuchkindsofupgradesaretomeettheincreasedrequirementstowardsampacityandheatdissipation.Thesenewrequirementsmayenforceadjustmentsintheutilizedpackagingtechnologiestoovercomethegivenpackagelimitations.Thecurrentarticleinvestigatesthechallengesofincreasedpowerdensitiesinexistingmodulepackagesandhowtheycanbemastered.1.IntroductionThecontinuoustrendofIGBTchipoptimization[1],[2]enablesIGBTpowermoduledeve
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